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Innovation、Integration、Solutions - MOS Technology Inc.

New Display 新型顯示器

 
microMIRA™ – High Throughput Laser Lift-Off (LLO) System
 

3D-Micromac’s brand-new laser LLO system provides highly uniform, force-free lift-off of flexible layers on wafers and large surface areas (up to GEN 6) and at high processing speeds. The system is built on a highly customizable platform that can incorporate different laser sources, wavelengths and beam paths to meet each customer’s unique requirements.
The laser system can be used for a variety of applications, such as device lift-off from glass and sapphire substrates in semiconductor manufacturing as well as OLED and microLED display manufacturing. Additional applications include laser annealing and crystallization for surface modification.

 
Features :
  • Force-free and extremely selective laser processing
  • No damage due to thermo-mechanical effects
  • Low production costs
  • Elimination of costly and polluting wet chemical processes
  • Integration of adjacent manufacturing steps for greater fab productivity
Configuration Packages :
microMIRA wafer : LLO of Si or Sapphire wafers
  Auxiliary processes available
 
microMIRA panel : LLO of OLED panels or other large substrates
  Annealing functionality on request
 
Suited for :
  • LED
  • Vertical LED
  • Low production costs
  • microLED
  • OLED
  • LTPS panel (ELA)
 
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Innovation、Integration、Solutions - MOS Technology Inc.
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