3D-Micromac’s brand-new laser LLO system provides highly uniform, force-free lift-off of flexible layers on wafers and large surface areas (up to GEN 6) and at high processing speeds. The system is built on a highly customizable platform that can incorporate different laser sources, wavelengths and beam paths to meet each customer’s unique requirements.
The laser system can be used for a variety of applications, such as device lift-off from glass and sapphire substrates in semiconductor manufacturing as well as OLED and microLED display manufacturing. Additional applications include laser annealing and crystallization for surface modification. |